
2UUL BGA REBALLING STENCIL FOR IPHONE 6 TO 12 PRO MAX
Thickness: 0.12mm
Stepped groove design enables stencil to align with the tinning position of ic rapidly
The square holes design makes it easier to take out the formed solder balls.
LCD SCREEN CABLE IC PROTECTION STENCILS IPHONE 11-13 PROMAX
iPhone 11 to 13 ProMax screen
LCD Screen IC Flex Cable Protection
Protecting the flex cable from damage
Precise alignment
High-quality steel
RELIFE RL-044 iPhone LCD Screen Repair Steel Stencil Set (4in1)
The set is composed of 4 templates:
1x reballing template IC display iPhone 6s up to iPhone 13 Pro Max
3x protecting flat cable templates iPhone 11, 12 and 13
Relife RL-044 IPZ13 precision BGA stencil iPhone 14 series
Relife RL-044 IPZ13 precision BGA stencil for iPhone 14 series
CPU integrated stencil
Thick: 0.12mm
Compatible iPhone Models: iPhone 14, iPhone 14 Pro, iPhone 14 Plus, iPhone 14 Pro Max
CPU A15, A16
QIANLI MIDDLE FRAME REBALLING PLATFORM 01 FOR IPHONE X-XS-XS MAX
CNC high-precision processing,
High-precision laser cutting
High-level craft guarantees you a better recalling experience
Laser cutting black stencil
QIANLI MIDDLE FRAME REBALLING PLATFORM 02 FOR IPHONE 11-11PRO-11PRO MAX
CNC high-precision processing,
High-precision laser cutting
High-level craft guarantees you a better recalling experience
Laser cutting black stencil
Qianli ToolPlus 3 IN 1 Middle Frame Reballing Platform for iPhone 11/11 PRO/PRO MAX
Magnetic attraction cover with positioning engrave
Anti-Deform steel made reballing stencils.
The bottom part with the positioning post.
Qianli-ToolPlus Middle Frame Reballing Platform for iPhone X-XS-XS Max
iPhone X/XS/XS Max middle frame reballing platform.
Magnetic attraction cover with positioning encrave
Anti-Deform steel made reballing stencils.
The bottom part with the positioning post.
Providing new methods to reballing middle frame with accuracy & efficiency.
QianLi 3D GOLD STENCIL FOR IPHONE CPU A9-A10-A11
QianLi 3D GOLD STENCIL FOR IPHONE CPU A9-A10-A11
Newest 3D Gold Stencil from QIANLI|ToolPlus
For iPhone CPU A9-A10-A11
More comfortable more precious also 3D !!!
The brand new iPhone stencils from QianLi
QianLi 2D GOLD STENCIL FOR iPHONE 6/6P IC
BGA Reballing Stencil Template for iPhone 6-6P, can be heated directly.
Thickness: 0.12mm
Material: High-Quality Stainless Steel
Hole Cut: Cubic-cut
Made in Japan
QianLi 3D BLACK STENCIL FOR iPHONE CPU A9-A10-A11
Newest 3D Black Stencil from QIANLI|ToolPlus
Stencil module 3D for iPhone A9-A10-A11 CPU
Say good bye to eyes sore when reballing,
More comfortable for your eyes and now also 3D !!!
Qianli Mega-Idea Black Stencil iPhone 11-11Pro/Pro Max
QianLi MEGA-IDEA
2D Black Reballing Stencils. square holes round angle BGA stencils.
Professional mobile phone repair tool sub-brand under QianLi ToolPlus.
Qianli Mega-Idea Black Stencil iPhone Series
Qianli Mega-Idea Black Stencil iPhone Series
QianLi MEGA-IDEA
2D Black Reballing Stencils. square holes round angle BGA stencils.
Professional mobile phone repair tool sub-brand under QianLi ToolPlus.
QIANLI MEGA-IDEA BLACK STENCIL IPHONE CPU A8-A9-A10-A11-A12
Mega-Idea: 2D Black Reballing Stencils.
Square holes round angle BGA stencils.
Available for iPhone CPU’S
Bga Stencil For iPhone 6S Plus
This is econmic-type BGA Reballing Stencil Template for iPhone 6S Plus, can be heat directly.
Thickness: 0.15mm
Materal: Stainless Steel
Hole Cut: Round-cut
G-LON SUNSHINE SS-032 REBALLING MAGNETIC FULL KIT FOR IPHONE X/XS/MAX
1x Synthetic stone (With magnetic buttons)
1x Special Solder Paste 158° for iPhone X/XS/XS Max
3x Highest quality stencil
Stencil thickness T0.12
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPAD SERIES
High precision BGA reballing stencil for iPad Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPHONE SERIES
High precision BGA reballing stencil for iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
High Quality BGA 3D Stencil MJ For A10
3D BGA for A10 , contains all 7, 7P
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
High Quality BGA 3D Stencil MJ For A9
3D BGA for A9 , contains all 6s, 6sP
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.