2UUL NANO SOLDER PASTE EXCLUSIVE USE FOR DOCK & FPC CONNECTOR
2UUL Nano Solder Paste Exclusive Use For Dock&Fpc Connector
2UUL RED SKULL SOLDER PASTE FOR REPAIR (148℃ 183℃ 199℃) 50G
2UUL Red Skull Solder Paste For Repair
Melting temperature: 148℃
Melting temperature: 183℃
Melting temperature: 199℃
Weight: 50G
2UUL SNK SOLDER PASTE 50 GR (148/189 DEGREES)
2UUL SNK Solder Paste 50 gr
Two different types of solder paste
Two melting temperatures:
Type One: 148 Degrees
Type Two: 189 Degrees
Aixun solder pastes SP-138/158/183℃ flux for SMD Mobile Repair
Aixun solder pastes SP-138/158/183℃ flux for SMD Mobile Repair
Solder paste models:
Aixun SP-138 (50g)
Aixun SP-158 (50 g)
Aixun SP-183 (50g)
AMTECH STIRRI RMA 063 (T4) 87%-SN63PB37 MT SOLDER PASTE 37% LEAD (ROL0) 20GR
AMTECH STIRRI RMA 063 (T4) 87%-SN63PB37 MT SOLDER PASTE 37% LEAD (ROL0) 20GR
RMA Sn63Pb37 Type-4 eutectic solder paste 20-38 micron powder grain size 87% load.
Used with 12-16mil high-pitch SMT assemblies in space exploration and defence contractor’s specs.
Small syringe container for repair/rework, and prototyping.
Liquidus/solidus point – 183C (Eutectic).
Powder composition: 63% Tin, 37% Lead.
Contains 13% RMA-TF no-clean soldering tacky paste flux
The package includes a dispensing Kit
AMTECH STIRRI RMA 063 (T5) 85%-SN63PB37 SOLDER PASTE 37% LEAD (ROL0) 20GR
AMTECH STIRRI RMA 063 (T5) 85%-SN63PB37 SOLDER PASTE 37% LEAD (ROL0) 20GR
RMA Sn63Pb37 Type-5 eutectic solder paste 15-25 micron powder grain size 85% load.
Used with 8-12mil high-pitch SMT assemblies in space exploration and defence contractor’s specs.
Small syringe container for repair/rework, and prototyping.
Liquidus/solidus point – 183C (Eutectic).
Powder composition: 63% Tin, 37% Lead.
Contains 13% RMA-TF no-clean soldering tacky paste flux
The package includes a dispensing Kit
AMTECH STIRRI RMA 063 (T6) 85%-SN63PB37 MT SOLDER PASTE 37% LEAD (ROL0) 20GR
AMTECH STIRRI RMA 063 (T6) 85%-SN63PB37 MT SOLDER PASTE 37% LEAD (ROL0) 20GR
RMA Sn63Pb37 Type-6 high-pitch eutectic solder paste 5-15 micron powder grain size 85% load.
Used with 5-8mil high-pitch SMT assemblies in space exploration and defence contractor’s specs.
Small syringe container for repair/rework, and prototyping.
Liquidus/solidus point – 183C (Eutectic).
Powder composition: 63% Tin, 37% Lead.
Contains 13% RMA-TF no-clean soldering tacky paste flux
The package includes a dispensing Kit
AMTECH STIRRI-LT-HF SN42BI57.6AG0.4 (T4) LOW-TEMP SOLDER PASTE (ROL0) 20GR
AMTECH STIRRI-LT-HF SN42BI57.6AG0.4 (T4) LOW-TEMP SOLDER PASTE (ROL0) 20GR
Amtech Stirri- Genuine Advanced Aerospace & military Grade Industrial Products.
Stirri-LT-HF Sn42Bi57.6Ag0.4 (T4 Low-Temp) rosin solder paste
87% powder load 0.4% silver no-clean lead-free halogen-free (ROL0)
The package includes a dispensing Kit
LUOWEI HIGH QUALITY SOLDER PASTE 138-158-183-217℃
LUOWEI HIGH QUALITY SOLDER PASTE 138-158-183-217℃
Luowei high-quality solder paste for repair New Formula!
Is storable and has excellent antioxidant performance, uniform and fine.
Strong Wettability,
Solder Joints Plump,
Excellent performance,
Lead-Free Greenest,
Multiple Specification.
4 Different types of melting temperatures:
138, 153, 183, 217℃
Net Weight: (50g)
Mechanic Lead-free Solder Paste 138-158-183-217℃
Mechanic Lead-free Solder Paste 138-158-183-217℃
A new formula has storability, excellent antioxidants, and quality over other suppliers.
Customized for high-precision maintenance,
It has moderate humidity, not easy to agglomerate,
Easy to tin, and no virtual soldering.
Mechanic XZ10 Solder Ball (0.2 to 0.76mm)
Mechanic XZ10 Solder Ball (0.2 to 0.76mm)
Mechanic Lead-Free/With Lead Solder Ball,
10.000 Capluses,
Sn63/Pb37 (Tin 63%/Lead 37&)
Small Tolerance,
No Static,
High Quality.
Size: from 0.2 to o.76mm
Mijing Needle Tube Tin Paste 138/ 150/ 183/ 199/ 217 ℃
Mijing Needle Tube Tin Paste 138/ 150/ 183/ 199/ 217 ℃
Mijing ZT-138/150/183/199/217℃ Solder Paste Syringe Flux
High conductivity and less residues,
Real material is widely used,
High wettability,
High adhesion
It comes with a push rod and needle.
For SMD BGA IC PCB Needle Tube Tin Paste Welding Cream
ORIGINAL FACTORY EFFECT SCREEN IC SEALANT FOR IPHONE MAINTENANCE BGA CPU NAND IC
Original factory effect screen IC sealant
For iPhone maintenance BGA CPU NAND IC chip black sealant
Fast curing in 30 seconds
Solve the appearance of sealing glue after moving the screen chip
Capacity: 3cc
Colour: black
(UV curing lamp is required)
QianLi Mega Idea Leaded Medium Temperature Solder Paste (18g)
High brightness and fullness of solder joints
Medium viscosity, no collapse, no deviation
No pseudo soldering, less residue
Strong adhesion, Rinse free
Melting point: 183 degrees Celsius
SN 63/Pb 37
18 grams
RELIFE RL062A MANUAL GLUE GUN NEEDLE BOOSTER
Ergonomic design
Comfortable grip
Smoot glue even force
Precise glue
Save time and effort comfortable to hold
Complimentary two needles of different specifications
Suitable for 10cc syringe oil
Two needles of different sizes are included
STANNOL SOLDER PASTE LOTPASTE 344 (179° 25GR)
Alloy: Sn62 Pb36 Ag2
Melting point, °C: 179
Metal content, %: 89.8 / 90.2 / 90.5
Solder powder, µm: 25-45
Viscosity Physica 25°C, Pa·s 50-210
Tau0 Physica 25°C 20-350
XZZ LEAD FREE TIN PASTE 138/158/183/199℃ SOLDER FLUX
XZZ LEAD FREE TIN PASTE 138/158/183/199℃ SOLDER FLUX
For Mobile Phones,
iPad Tablet,
Logic Board PCB BGA SMD PGA
Welding Desoldering Repair.
XZZ low/medium/high temperature leaded/lead-free solder flux paste.
YCS BGA high quality Solder Paste (215℃ 199℃ 183℃ 150℃ 138℃)
YCS Solder Paste
High Quality, soldering paste,
For Mobile Phones, iPad Tablet,
Logic Board PCB BGA SMD PGA,
Excellent antioxidant performance,
Uniform and fine.
Strong Wettability,
Excellent performance,
Welding Desoldering Repair.
(215℃ 199℃ 183℃ 150℃ 138℃)
MECHANIC ISM5 SPECIAL SOLDER PASTE FOR PHONE JUMPER WIRE
iSm5 Mechanic Jump Wire Special paste with 3pcs Needle
Volume: 3ML
Temperature: 220-230 ℃
Easy to tin, high activity, Flying line on the touch, tin point full
GLASS SYRINGE 10ML WITH 12 PRECISION NEEDLES INCLUDED
Glass Syringe 10 ml with 12 precision needles included
Perfect for dosing the flux for repairs on the motherboard
AMTECH Sn42/Bi57.6/Ag0.4 (T4) Low-Temp Solder Paste (NC-31) 35 gr
Sn42/Bi57.6/Ag0.4, Solder Paste
Classification ROL0
35g syringe, Compatible Alloys
Properties: No-clean, Standard
ChipQuick Solder Paste no clean Two Part Mix 15g 138°
ChipQuick Solder Paste no clean Two Part Mix 15g 138°
Melting Point: 138C (281F)
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
ChipQuik Solder Paste no clean Two Part Mix 15 217°
ChipQuik Solder Paste no clean Two Part Mix 15 217°
Melting Point: 217-220C (423-428F)
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
G-LON RELIFE IPHONE MIDDLE LAYER SOLDER PASTE (158°)
G-Lon Relife Solder Paste
For iPhone Middle Layer Special Solder Paste
Melting Point: 158°
Weight: 50gr
MECHANIC High-End SOLDER PASTE XGS40 42G 158℃
High-end Mobile phone fix unique recipes, perfect performance,
Easy to weld, solder bright and full,
Total Weight: 44g
Viscosity : 178 +/-10
Melting Point: 158℃
Alloy: Sn63/Pb37
Micron (µm) Range: 20 – 38µm
MECHANIC V6S35 HIGH-TEMPERATURE SOLDER PASTE (40G)
High-Temperature Lead-Free Solder Paste
Version: V6S35
Weight: 40g
Brand: Mechanic
MECHANIC LOW-TEMPERATURE SOLDER PASTE 138°
Low-temperature solder paste V5B45 138 Degree
Brand: Mechanic
Microns: 25-45um
Weight: 42Gr
MECHANIC V40-BS458 LOW-TEMPERATURE SOLDER PASTE (40G)
Low-temperature lead-free solder paste V40-BS458, 40g
Brand: Mechanic
Mechanic SOLDER PASTE V4S35 217 Degrees 40GR
Mechanic CPU lead-free Solder Paste high-temperature CPU rework
Size microns: 20-38μm
Model Number: V4S35
Application: Mobile phone repair
Function: Welding Paste
Melting point: 217 degrees
MIJING 30g 138°C LOW Temperature Solder Paste Tool for PCB SMD BGA
MIJING 30g 138°C MJ503B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
MIJING 30g 189°C High Temperature Solder Paste Tool for PCB SMD BGA
MIJING 30g 189°C MJ501B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
PPD Lead-free low-High temperature solder paste 138/183/217 degrees
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
No-clean and Lead-free for environmental protection
3 different temperature:
138℃ (S260)
183℃ (S600)
217℃ (S360)
Relife RL-401-403 Soldering Reballing Paste (183 °C)
Relife RL-401-403 Soldering Reballing Paste (183 °C)
RELIFE 183℃ Solder paste RL-401-403
Model: RL-4 Series
Alloy: Sn63/Pb37
Viscosity: 160-230Pa.s
Microns: 20-38um
No Clean
RELIFE, real quality, born for mobile repair.
Relife RL-404 138° Low-Temperature Solder Paste 50GR
Relife RL-404 138° Low-Temperature Solder Paste
A low-temperature lead-free solder paste customized for high-end motherboard repair
Tin lighting/climbing High purity Temperature
Weight: 50gr
Relife RL-405 MOTHERBOARD JUMPING WIRE SOLDER PASTE
Suitable for jump wire, CPU soldering, tail charger repair etc.
Fine paste, environmentally-friendly lead-free
Needle Tube Design, controllable usage, refuse to waste
Net Weight 3ml (15g)
3x Needle included
ROTARY TYPE TUBEMATE SYRINGE FOR FLUX TUBE MIJING HB21
The grip feels comfortable, improve the work efficiency
Suitable for Soldering Flux, Soldering Mask etc
Resistance to high-temperature corrosion