Aixun solder pastes SP-138/158/183℃ flux for SMD Mobile Repair

The AiXun lead-free solder paste comes in different types with varying melting points, allowing it to be used in a wide range of soldering applications.

• Aixun SP-138: degree low-temperature paste, is specifically designed for use in iPhone X/XS/XSMAX middle frame and mainboard tin planting.
  It has a low melting point, which allows it to be used on delicate components without damaging them.
  The lead-free and silver-containing formula is also beneficial for environmental protection.
  The tin balls it creates are delicate, round, and full, and it has a good viscosity, which prevents blistering and even solder beads.
• Aixun SP-158: solder paste is a lead-free and silver-containing solder paste that is designed for use in mobile chip and double motherboard maintenance.
  The inclusion of silver provides improved electrical conductivity, and its melting point is suitable for components that require moderate bonding strength.
• Aixun SP-183: degree medium-temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing.
  It has a higher melting point than the SP-138 paste, making it more suitable for components that require stronger bonds.
  It has a strong tin climbing ability, good conductivity, and strong tin load capacity, which enables no rework after planting balls.

Additional information