High Quality BGA 3D Stencil MJ For A10
SKU: PPA79496
€10,50
In Stock
3D BGA for A10 , contains all 7, 7P
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
In stock
MJ 3D BGA Reball Stencil for A10
0.025mm thickness
3D BGA for A10 7, 7 Plus
It is 3D
Contains all 7, 7P BGA
Feathure:
Stepped groove design enables stencil to align with tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter you are a new or expert.
High success rate of planting tin,the solder balls can be formed once afer you are proficient.
This 3D planting stencil is thicker than ordinary stencils in the market.
Less tendency of deformation makes its using life be longer.
Additional information
| Weight | 0,05 kg |
|---|
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