High Quality BGA 3D Stencil MJ For A9

MJ 3D BGA Reball Stencil for A9
0.025mm thickness
3D BGA for A9 6S, 6S Plus
It is 3D
Contains all 6S 6SP BGA
Features:
Stepped groove design enables stencil to align with tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter you are a new or expert.
The high success rate of planting tin,the solder balls can be formed once after you are proficient.
This 3D planting stencil is thicker than ordinary stencils in the market.
Less tendency of deformation makes its using life be longer.

Additional information