IPHONE X MIDDLE LAYER BGA BOARD MJ
SKU: PPA197188
€2,70
In Stock
Mijing iPhone X Middle Layer Board
In stock
Mijing iPhone X Middle Layer Board
Additional information
| Weight | 0,01 kg |
|---|
Related Products
MJ HG201 UNIVERSAL Mobile Phone HOLDER Back Cover Glass Removal
€11,50
Universal Holder For Phone Removal/Repair Back Cover Glass
Mijing HG201, rear cover removal clamp
Suitable for mobile phones within 8 inches with the back cover removed
In Stock
High Quality BGA 3D Stencil MJ For A9
€11,90
3D BGA for A9 , contains all 6s, 6sP
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
In Stock
MJ K27 PCB HOLDER MULTI-FUNCTION FOR IPHONE 11 PRO-PRO MAX
€16,50
Cooling logic board fixture
High-quality multifunctional iPhone PCB repair platform tool
Different sections for iPhone CPU NAND Chips Positioning, Soldering, Desoldering, Reballing
In Stock
Reviews
There are no reviews yet.