MECHANIC Heat Kit Preheating-Cooling System for X-14PM Motherboard

SKU: PPA433050
129,00
In Stock

New Mould for iPhone 14 Series included!!!
For iPhone X to 14 Pro Max Motherboard Laminating Layering Tool
Double ceramic heating element!
Faster heating, more uniform temperature and stable performance.
5 professional mode selections,
3 common modes of operation

In stock

New Mould for iPhone 14 Series included!!!

Mechanic Heat Kit Preheating Platform Built-In Wind Cooling System.

For iPhone X to 14 Pro Max Motherboard Laminating Layering Tool

Double ceramic heating element!

The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature and stable performance.

5 professional mode selections,
3 common modes of operation

5 kinds of application scene modes of removing glue, layering, laminating, tin planting and welding can be switched arbitrarily.

Commonly used memory temperatures, automatic recording of the current temperature (save when powered off) and manual recording of the current temperature mode.

Glue removal mode/layer mode/lamination mode/soldering mode/soldering mode.

Application:
The latest support for iPhone X/XS/XS Max/1/11 Pro/11 Pro Max/12 Mini/12/12 Pro/12 Pro Max/13 Mini/13/13 Pro/13 Pro Max, New14, 14 Plus, 14 Pro, 14 Pro Max

3.4-inch colour screen display
Turbofan blade cooling,
Time-temperature curve,
Dual ceramic heating element,
5 professional modes,
3 memory temperatures.

A perfect solution for new mobile phone motherboard desoldering reflow soldering heating platform,
especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow

Packing list:
Host: 1x
Power cord: 1x
Module: 6x
Steel mesh: 12x

 

 

 

 

Additional information

Weight 1,3 kg

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