PPD Lead-free low-High temperature solder paste 138/183/217 degrees
€6,90 – €7,90
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Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
No-clean and Lead-free for environmental protection
3 different temperature:
138℃ (S260)
183℃ (S600)
217℃ (S360)
Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead-free for environmental protection
Temperature:
138℃ (S260)
183℃ (S600)
217℃ (S360)
Volume : 50 Gr / Bottle
Can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
Additional information
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