PPD Lead-free low-High temperature solder paste 138/183/217 degrees

 
6,907,90
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Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
No-clean and Lead-free for environmental protection
3 different temperature:
138℃ (S260)
183℃ (S600)
217℃ (S360)

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Feature :
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead-free for environmental protection
Temperature:
138℃ (S260)
183℃ (S600)
217℃ (S360)
Volume : 50 Gr / Bottle

Can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.

 

Additional information

Version

138 Degrees, 183 Degrees, 217 Degrees

Dimensions
Weight 0,05 kg

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