QianLI Mega Idea iPhone11-11 Pro-11 Pro Max Welding Desoldering Heater

QianLI Mega Idea iPhone 11/11Pro/11 Pro Max  Welding Desoldering Heater
Avenger Soldering/Desoldering Station
Highly refine copper heating core adapted.
Excellent heating efficient, reach 200 ℃ within a minute
CPU slots designed on the heating platform.
Suitable for Disassembly & Welding
Precise fit on copper plate enables precise operation
Mega IDEA Thermostatic Motherboard Unsoldering Station solves the problem of inaccurate alignment when soldering
Applicable models of Motherboard
This device is suited for 3 iPhone models
This device can be used to disassemble motherboard of iPhone 11/11Pro/11 Pro Max 
Its surface is designed for these motherboards to fit perfectly!!
Fast Heating
Reaches 211°C in 2 minutes
Designed to prevent temperature reduction during heating, increasing heating rate
Remove Glue & Tin
Removing glue and tin for applicable chips
Groove design enables to heat CPU of iPhone 11/11Pro/11 Pro Max, for tin & glue remove
Insulated Thermal Pad
Prevents the flow of electricity to the copper plate and the loss of heat
The most existing unsoldering station in the market do not have this feature- it is dangerous when electricity leaks from the power source on the copper plate during operation!
Silicone insulated Cover
Effective Insulation,
At high temperatures, unsoldering stations without the silicone cover may damage users’ finger and workstations during operation
With the silicone cover operation become much safer

Additional information