WL HIGH-QUALITY REBALLING STENCIL A11-2 CPU
SKU: PPA266663
€9,50
In Stock
BGA Reballing Stencil Tin Steel for iPhone A11 CPU
With Fixed Plate
Easy to use and more accurate IC welding position
Package includes:
1x Stainless Stencil
1x Heat resistant mould in Synthetic Stone
In stock
BGA Reballing Stencil Tin Steel for iPhone A11-2 CPU
With Fixed Plate
Easy to use and more accurate IC welding position
Package includes:
1x Stainless Stencil
1x Heat resistant mould in Synthetic Stone
Additional information
Weight | 0,05 kg |
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