IC Chip BGA Reballing Stencil Tin Steel Net for iPhone 8/8P/X
iPhone HDD PCI-E / Baseband Repair BGA Reballing Net with Fixed Plate,
Easy to use and more accurate IC welding position
This is econmic-type BGA Reballing Stencil Template for iPhone 6S Plus, can be heat directly.
Thickness: 0.15mm
Materal: Stainless Steel
Hole Cut: Round-cut
High precision BGA reballing stencil for iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
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