
MIJING TRIANGEL LASER SOLDERING/DESOLDERING STATION LWS-301
Laser spot size:10mm/6mm
Laser power: 15W*2, 10 levels adjustable
Cooling method: air cooling
Power Up is to increase power (10 levels adjustable)
Power Down is to reduce power (10 levels adjustable)
The machine is equipped with two memory buttons:
CH1 and CH2 (long press for 3 seconds to save),
Can set two groups of power parameters that you commonly use.
MIJING IREPAIR MS1 COMPLETE PCB PREHEATER FOR IPHONE X-13PROMAX/ANDROID
Support: iPhone X, Xs, Xs Max, 11, 11Pro/ProMax, 12Mini, 12/Pro/Max, 13Mini, 13Pro/Max, Android.
1: iPhone X – to 11 Pro Max
2: iPhone 11 Series
3: iPhone 13 Series
4: Universal Android module
5: DOT Matrix/Fingerprint module
MIJING P13 PCIE NAND HARD DISK PROGRAMMER FOR 6S-13PROMAX
Support full range of ios devices’ NAND Disk,
Boot code reflashes, syscfg repair,
WiFI unlocked.
More than 33 models including the ix ios device are Supported by iRepair P13 box.
MIJING PAD CLEANING SIDEBURNS BRUSH (2PCS)
Mijing Pad Cleaning Sideburns Brush (2PCS)
The package includes 2 different types of brushes:
1: IC PAD Steel Brush,
2: Sideburn Brush
MIJING PM-11 UNIVERSAL CLAMP/HOLDER FOR MOBILE DISASSEMBLY
MiJing PM-11
Universal Adjustable Holder/Clamp For Mobile LCD
Screen Fastening Clamp Holder
Flexible Screen Fastening Clamp
Fixing Bracket for Mobile Phone Disassembly
MJ K23 Max multifunction PCB fixture
Mijing K23 Max multifunction PCB fixture
Has been designed to be compatible with a range of motherboards, including those used in the iPhone 14 series.
Suitable for use with Apple A9 to A16 CPUs
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPAD SERIES
High precision BGA reballing stencil for iPad Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPHONE SERIES
High precision BGA reballing stencil for iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
High Quality BGA 3D Stencil MJ For A10
3D BGA for A10 , contains all 7, 7P
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
High Quality BGA 3D Stencil MJ For A9
3D BGA for A9 , contains all 6s, 6sP
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
MIJING 30g 138°C LOW Temperature Solder Paste Tool for PCB SMD BGA
MIJING 30g 138°C MJ503B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
MIJING 30g 189°C High Temperature Solder Paste Tool for PCB SMD BGA
MIJING 30g 189°C MJ501B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
MIJING HY258 LO SMT SOLDER FLUX 10CC
Mijing iRepair HY-258 LO solder paste flux
Environmental protection lead-free solder paste
Antioxidant flux paste for BGA, IC chips
Push-Type Ergonomic Design
MIJING IPHONE 11PRO-11PROMAX MIDDLE LAYER BGA BOARD
Mijing iPhone 11pro/11promax Middle Layer BGA Board
MIJING K35 MULTI-FUNCTION PCB HOLDER FOR IPHONE 12-12MINI-2PRO-12PROMAX
General mobile phone maintenance fixture
Rotary fixed design, no rebound, fixed firmly
The design has three adjustable distances
Prevent clamps from moving during use
Special anti-skid pad
MIJING Z20 PRO BGA REBALLING FIXTURE 14IN1 FOR IPHONE X-13PROMAX
MJ 14 in 1 BGA Reballing Stencil Platform
Professional BGA Reballing Stencil Fixture for iPhone X-13 PM,
Motherboard BGA reballing tool is used for positioning and reballing iPhone X- 13 PM PCB BGA parts,
Mijing Z21 8 IN 1 Reballing Stencil Template Groove FOR IPHONE CPU A8 TO A14
Reballing Stencil Template Groove for iPhone CPU
Can reballing CPU’s from A8 to A14
Square opening
High-quality material
MJ C17 FOR IPHONE X/XS/XS MAX MAIN BOARD TESTING
Easy to use, connect the upper and lower motherboards for testing/repair,
increase maintenance speed
MJ C18 FOR IPHONE 11/11PRO/11 PRO MAX MAIN BOARD TESTING
Easy to use, connect the upper and lower motherboards for testing/repair
Increase maintenance speed
Compact Quality Build- Small size
Made from toughened alloy with nylon spacers.
MJ CH5 Intelligent Layered Welding Platform iPhone X/XS/XSMAX
MiJing CH5 Intelligent Mainboard Layered Welding Platform for iPhone X/XS/XSMAX
Three-in-one universal iPhone X/XS/XSMAX,
Support A11 A12 CPU chip,
Support A11 A12 HHD,
iPhone X Baseband,
iPhoneXS/XSMAX baseband and glue removal.
MJ GD 10 GLASS RAPPER BREAKING PEN FOR IPHONE BACK GLASS
Mijing GD-10 iPhone Back Glass Breaking
Curved and flat- glass demolishing pen
No damage to the LCD screen.
Easy to operate.
Adjustable Strength
MJ HG201 UNIVERSAL Mobile Phone HOLDER Back Cover Glass Removal
Universal Holder For Phone Removal/Repair Back Cover Glass
Mijing HG201, rear cover removal clamp
Suitable for mobile phones within 8 inches with the back cover removed