MIJING TRIANGEL LASER SOLDERING/DESOLDERING STATION LWS-301
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MIJING TRIANGEL LASER SOLDERING/DESOLDERING STATION LWS-301
Laser spot size:10mm/6mm
Laser power: 15W*2, 10 levels adjustable
Cooling method: air cooling
Power Up is to increase power (10 levels adjustable)
Power Down is to reduce power (10 levels adjustable)
The machine is equipped with two memory buttons:
CH1 and CH2 (long press for 3 seconds to save),
Can set two groups of power parameters that you commonly use.
Discount 5%
MIJING IREPAIR MS1 COMPLETE PCB PREHEATER FOR IPHONE X-13PROMAX/ANDROID
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MIJING IREPAIR MS1 COMPLETE PCB PREHEATER FOR IPHONE X-13PROMAX/ANDROID
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Support: iPhone X, Xs, Xs Max, 11, 11Pro/ProMax, 12Mini, 12/Pro/Max, 13Mini, 13Pro/Max, Android.
1: iPhone X – to 11 Pro Max
2: iPhone 11 Series
3: iPhone 13 Series
4: Universal Android module
5: DOT Matrix/Fingerprint module
MIJING PAD CLEANING SIDEBURNS BRUSH (2PCS)
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MIJING PAD CLEANING SIDEBURNS BRUSH (2PCS)
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Mijing Pad Cleaning Sideburns Brush (2PCS)
The package includes 2 different types of brushes:
1: IC PAD Steel Brush,
2: Sideburn Brush
MIJING PM-11 UNIVERSAL CLAMP/HOLDER FOR MOBILE DISASSEMBLY
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MIJING PM-11 UNIVERSAL CLAMP/HOLDER FOR MOBILE DISASSEMBLY
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MiJing PM-11
Universal Adjustable Holder/Clamp For Mobile LCD
Screen Fastening Clamp Holder
Flexible Screen Fastening Clamp
Fixing Bracket for Mobile Phone Disassembly
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPAD SERIES
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HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPAD SERIES
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High precision BGA reballing stencil for iPad Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPHONE SERIES
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HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPHONE SERIES
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High precision BGA reballing stencil for iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
High Quality BGA 3D Stencil MJ For A10
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High Quality BGA 3D Stencil MJ For A10
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3D BGA for A10 , contains all 7, 7P
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
High Quality BGA 3D Stencil MJ For A9
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High Quality BGA 3D Stencil MJ For A9
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3D BGA for A9 , contains all 6s, 6sP
It is 3D, 0.025mm thickness
The square holes design makes it easier to take out the formed solder balls.
3D stencil is easy to use no matter you are a new or expert.
MIJING 30g 138°C LOW Temperature Solder Paste Tool for PCB SMD BGA
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MIJING 30g 138°C LOW Temperature Solder Paste Tool for PCB SMD BGA
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MIJING 30g 138°C MJ503B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
MIJING 30g 189°C High Temperature Solder Paste Tool for PCB SMD BGA
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MIJING 30g 189°C High Temperature Solder Paste Tool for PCB SMD BGA
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MIJING 30g 189°C MJ501B
High-Temperature Solder Paste Tool for PCB SMD BGA
High-quality solder paste
Tack lasting, easy to dry
MIJING CH5-B+C INTELLIGENT LAYERED WELDING PLATFORM IPHONE 11/11PRO/MAX (FULL KIT)
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5 in-1 universal iPhone 11, 11 Pro, 11 pro Max
Support A13 CPU chip (A13 HHD)
iPhone 11/11P Baseband,
iPhone 11/11P baseband and glue removal
MIJING HY258 LO SMT SOLDER FLUX 10CC
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MIJING HY258 LO SMT SOLDER FLUX 10CC
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Mijing iRepair HY-258 LO solder paste flux
Environmental protection lead-free solder paste
Antioxidant flux paste for BGA, IC chips
Push-Type Ergonomic Design
MIJING IPHONE 11PRO-11PROMAX MIDDLE LAYER BGA BOARD
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MIJING IPHONE 11PRO-11PROMAX MIDDLE LAYER BGA BOARD
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Mijing iPhone 11pro/11promax Middle Layer BGA Board
MIJING K35 MULTI-FUNCTION PCB HOLDER FOR IPHONE 12-12MINI-2PRO-12PROMAX
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MIJING K35 MULTI-FUNCTION PCB HOLDER FOR IPHONE 12-12MINI-2PRO-12PROMAX
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General mobile phone maintenance fixture
Rotary fixed design, no rebound, fixed firmly
The design has three adjustable distances
Prevent clamps from moving during use
Special anti-skid pad
MIJING Z20 PRO BGA REBALLING FIXTURE 14IN1 FOR IPHONE X-13PROMAX
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MIJING Z20 PRO BGA REBALLING FIXTURE 14IN1 FOR IPHONE X-13PROMAX
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MJ 14 in 1 BGA Reballing Stencil Platform
Professional BGA Reballing Stencil Fixture for iPhone X-13 PM,
Motherboard BGA reballing tool is used for positioning and reballing iPhone X- 13 PM PCB BGA parts,
Mijing Z21 8 IN 1 Reballing Stencil Template Groove FOR IPHONE CPU A8 TO A14
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Mijing Z21 8 IN 1 Reballing Stencil Template Groove FOR IPHONE CPU A8 TO A14
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Reballing Stencil Template Groove for iPhone CPU
Can reballing CPU’s from A8 to A14
Square opening
High-quality material
MJ A21+ PCB HOLDER MULTIFUNCTIONAL FOR IPHONE
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MJ A21+ PCB HOLDER MULTIFUNCTIONAL FOR IPHONE
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The base made of stainless steel and high temperature resistent
Anti-static composite slab
Designed for iPhone 5S 6 6S 7 8 Plus/ A7 A8 A9 A10
MJ C17 FOR IPHONE X/XS/XS MAX MAIN BOARD TESTING
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MJ C17 FOR IPHONE X/XS/XS MAX MAIN BOARD TESTING
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Easy to use, connect the upper and lower motherboards for testing/repair,
increase maintenance speed
MJ C18 FOR IPHONE 11/11PRO/11 PRO MAX MAIN BOARD TESTING
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MJ C18 FOR IPHONE 11/11PRO/11 PRO MAX MAIN BOARD TESTING
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Easy to use, connect the upper and lower motherboards for testing/repair
Increase maintenance speed
Compact Quality Build- Small size
Made from toughened alloy with nylon spacers.
MJ CH5 Intelligent Layered Welding Platform iPhone X/XS/XSMAX
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MJ CH5 Intelligent Layered Welding Platform iPhone X/XS/XSMAX
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MiJing CH5 Intelligent Mainboard Layered Welding Platform for iPhone X/XS/XSMAX
Three-in-one universal iPhone X/XS/XSMAX,
Support A11 A12 CPU chip,
Support A11 A12 HHD,
iPhone X Baseband,
iPhoneXS/XSMAX baseband and glue removal.
MJ GD 10 GLASS RAPPER BREAKING PEN FOR IPHONE BACK GLASS
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MJ GD 10 GLASS RAPPER BREAKING PEN FOR IPHONE BACK GLASS
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Mijing GD-10 iPhone Back Glass Breaking
Curved and flat- glass demolishing pen
No damage to the LCD screen.
Easy to operate.
Adjustable Strength
MJ HG201 UNIVERSAL Mobile Phone HOLDER Back Cover Glass Removal
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MJ HG201 UNIVERSAL Mobile Phone HOLDER Back Cover Glass Removal
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Universal Holder For Phone Removal/Repair Back Cover Glass
Mijing HG201, rear cover removal clamp
Suitable for mobile phones within 8 inches with the back cover removed