AMTECH STIRRI RMA 063 (T6) 85%-SN63PB37 MT SOLDER PASTE 37% LEAD (ROL0) 20GR
RMA Sn63Pb37 Type-6 high-pitch eutectic solder paste 5-15 micron powder grain size 85% load.
Used with 5-8mil high-pitch SMT assemblies in space exploration and defence contractor’s specs.
Small syringe container for repair/rework, and prototyping.
Liquidus/solidus point – 183C (Eutectic).
Powder composition: 63% Tin, 37% Lead.
Contains 13% RMA-TF no-clean soldering tacky paste flux
The package includes a dispensing Kit
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Amtech Stirri- Genuine Advanced Aerospace & military Grade Industrial Products.
RMA Sn63Pb37 Type-6 high-pitch eutectic solder paste 5-15 micron powder grain size 85% load.
Used with 5-8mil high-pitch SMT assemblies in space exploration and defence contractor’s specs.
Small syringe container for repair/rework, and prototyping.
Liquidus/solidus point – 183C (Eutectic).
Powder composition: 63% Tin, 37% Lead.
Contains 13% RMA-TF no-clean soldering tacky paste flux
High-quality leaded Sn/Pb solder powder made using virgin raw materials.
Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky flux.
Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air
RMA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework – delivers instant bridge-free reflow with Hot Air. Quick response to a solder iron.
Essential for leaded rework/repair, solar exploration, unmanned flying devices and Sn63Pb37 military tech
Clear residue is not corrosive and can be left on PCB, removed with isopropanol, and cleaned in ultrasonic or vapour degreasers.
Contains QC-Aid special optical tracer glowing in UV for immediate visual PCB contamination inspection – easy to detect using UV/blacklight light and easy to clean using Isopropanol or any industrial solvent cleaner – the paste will glow in UV highlighting affected areas.
QC-Aid – Everyone Can QC!
Factory-made in the USA using certified conflict-free solder powder traced back to original alloy smelters.
Viscosity Solder Paste / Flux
Printing applications: 200 to 275 (x103 mPa/s)
Dispensing applications: 100 to 150 (x103 mPa/s)
Tacky Flux: 40-70 (x103 mPa/s)
* Tested according to IPC-TM-650
Paste Tack Value
Typical tackiness: 38-48g force
Low Oxide Powder Distribution
Micron Size | Type | Pitch Requirements |
45 – 75μm | Type-2 | 24 mil and above |
25 – 45μm | Type-3 | 16 – 24 mil |
20 – 38μm | Type-4 | 12 – 16 mil |
15 – 25μm | Type-5 | 8 – 12 mil |
5 – 15μm | Type-6 | 5 – 8 mil |
2 – 11μm | Type-7 | < 5 mil |
Cleaning
No-clean solder paste can be left on the board for many SMT assemblies.
For applications requiring cleaning, the paste can be cleaned using commercial flux residue removers.
Storage
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months.
Unopened solder paste stored at room temperature, 25°C (77°F) will have a one-month shelf life.
Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down.
Allow 4-8 hours for the solder paste to reach an optimal operating temperature of 20-25°C (68-77°F).
Keep the solder paste container sealed while warming the solder paste to operating temperature.
Never Freeze Solder Paste!
The package includes a dispensing Kit containing the following items:
1 x universal plunger suitable for air syringes
1 x 1/2″ blunt dispensing tip 14 Ga (olive)
1 x 1/2″ blunt dispensing tip 20 Ga (pink)
1 x Original AMTECH Soldering Profiles & Temperature Reference card
Additional information
Weight | 0,05 kg |
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