PRECISION BGA STENCIL QUALCOMM WCD WCN WI-FI RELIFE RL-044-WC1
The pioneering half etching process, let some components fit into the groove
Protect components to avoid burns.
Cooling hole patented design, rapid heat dissipation
Ultra-precise round square hole positioning, precision of hole
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RELIFE RL-044
Precision BGA Stencil
1. The pioneering half etching process, let some components fit into the groove
Protect components to avoid burns.
2. Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3. Ultra-precise round square hole positioning, the precision of hole, Round square hole design, Easy to take off the steel, Make the operation more smooth.
4. Double blister packaging, hard paper package, protect the steel mesh from being crushed and deformed during transportation.
Additional information
Weight | 0,05 kg |
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