Special Edition 3 TEMPERATURES BGA PCB SOLDER PASTE TOOLGUIDE
€3,40
Choose an option
T-323 High Temperature:
Lead-Free, Alloy: Sn99 Ag0.3 Cu0.7
Microns: 25-45um
T-324 Low Temperature:
Lead-Free, Alloy: Sn42/Bi58
Microns: 25-45um
T-325 Mid Temperature:
With Lead, Alloy: Sn63/Pb37
Microns: 25-45um
Toolguide special edition BGA Solder paste, with 3 different temperatures:
Ideal for all types of welding, for the IC reballing or iPhone X Series layer
1:) T-323 High Temperature:
Lead-Free, Alloy: Sn99 Ag0.3 Cu0.7
Microns: 25-45um
2:) T-324 Low Temperature:
Lead-Free, Alloy: Sn42/Bi58
Microns: 25-45um
3:) T-325 Mid Temperature:
With Lead, Alloy: Sn63/Pb37
Microns: 25-45um
Additional information
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