Stannol FINE FLUXER EF-350 Flux pen (8 ml)

Description:
Pen with application brush contains 8ml Stannol flux of the type EF 350
The halogen-free activated No-Clean Flux EF350 guarantees outstanding wetting capability on different surfaces (e.g. OSP, Ni/Au, HAL, chemical Sn and chemical Ag) both with lead-free and solder alloys containing lead.
Special additives have been integrated into the formulation of the flux to meet the requirements for the solder behaviour of the flux and the electrical safety of the circuit board.

Characteristics:
Stannol EF350 offers the following advantages:
Multi-purpose application, low residues
Moderate solid content – fast wetting
No-clean application, electrically safe
Perfect wetting results with lead-containing and lead-free alloys

Product Advantages:
Universally usable
High solid content – fast wetting
No-Clean
Electrically safe residues
Outstanding wetting characteristics

Application:
EF350 is a flux with a very large range of applications.
It can be used universally very well.
EF350 can be used well both for wave soldering as well as for selective soldering.
EF350 flux can also be used well for selective soldering
The preheat temperature should be at least 90° C measured on the surface of the circuit board
Preheat temperatures up to 120-130°C for a short period of time may be tolerated by the flux.

Technical data:
Colour: light-yellow
Density at (20°C): 0.811 g/cm3
Flashpoint (closed crucible): 12°C
Ignition temperature: 425°C
Solid content: 3.5%
Acid rating: 27.0 mg KOH/g
Halide content: none
Copper mirror test: passed
Silver chromate paper test: passed
Surface Insulation Resistance: >108 Ω
Corrosion: none
Thinner Stannol VD-500

Stannol EasyFlux 350 is halide free activated.
The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL, chem Sn and chem.Ag) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.
The EF350 may be used with lead-containing and lead-free solders, where best wetting result may be achieved.
A low percentage of special additives were integrated into the flux formulation in order to meet the requirements on the soldering behaviour of the flux and the electrical safety of the residues, left after soldering.

Additional information