STANNOL SOLDER PASTE LOTPASTE 344 (179° 25GR)

Product Description:
The solder paste 344 is not only excellent in processing property but also low and clear
Residues and missing solder ball formation marked. It meets the requirements of the current test standards
and is therefore ideally suited for all applications in SMT and hybrid technology.

Product Features:
The product offers the following advantages:
• suitable for FinePitch • no-clean • work under air and nitrogen
• Halogen-free • Stencil, screen printing or dispenser

Use:
The solder paste 344 is for the production of fine-pitch electronics and any other application in the
suitable for electronics production.

Processing Properties:
The solder paste 344 contains an organic binder system as a homogeneous mixture in addition to the oxide-free soft solder powder
synthetic resin base, which is characterised by excellent printing and assembly properties, contour stability, long
service life and good temperature stability. After removing the paste, prevent premature drying
prevent you from carefully closing the paste container again immediately. A paste that has already been used is disconnected
to keep.

Application Parameters Recommendation:
This solder paste is well suited for reflow soldering with and without nitrogen—the recommended soldering profile in the saddle profile.
The peak temperature should be 225°C on the top of the board. Here should be a soldering profile with a total duration
be driven from about 6 minutes.

Cleaning:
Due to the low residue of the solder paste 344, cleaning after soldering usually is not necessary. If
due to special requirements nevertheless a clean

Alloy: Sn62 Pb36 Ag2
Melting point, °C: 179
Metal content, %: 89.8 / 90.2 / 90.5
Solder powder, µm: 25-45
Viscosity Physica 25°C, Pa·s 50-210
Tau0 Physica 25°C 20-350

Additional information