UNIVERSAL HARD DISK BGA REBALLING STENCIL MJ FOR IPHONE/IPAD SERIES
SKU: PPA171871
€3,25
In Stock
High precision BGA reballing stencil for iPad/iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
In stock
High precision BGA reballing stencil for iPad/iPhone Series
This product adopts import material and advanced technology
Can be laser engraving custom logo and text content
Precision square hole, one molding, improve working efficency
Fast allignement of the chip foot, the hole wall is uniform without burr
Unique heat dissipation drum package design
Steel has strong toughness ans is not easy to deform
Mijing Mobile Phone Tools
Additional information
Weight | 0,05 kg |
---|
Reviews
There are no reviews yet.